| 摘要 |
<p>PROBLEM TO BE SOLVED: To fill a gap between a semiconductor chip and a circuit substrate with resin in a short time while no bubble remains in the gap between the semiconductor chip and the circuit substrate when filling the resin is finished. SOLUTION: After a semiconductor chip 10 is mounted on a circuit board 20B, the gap between the semiconductor chip 10 and the circuit board 20B is directly filled with sealing resin 40 through a through hole 25B. A step part 200B corresponding to the thickness of a resist layer 28B is made on a rear surface 27B of the circuit substrate 20B, and the sealing resin 40 is blocked by the step part 200B. In heating and hardening the sealing resin 40, the semiconductor chip 10 is heated with light beam.</p> |
