发明名称 |
RACK MOUNTING LEAD FRAME AND LEAD FRAME PLATING SYSTEM USINGTHIS |
摘要 |
<p>PROBLEM TO BE SOLVED: To automatically load/unload a rack mounted with a lead frame. SOLUTION: A lead frame mounting system is provided with a rack 32 for mounting a lead frame to be electroplated, a conductor supporting bar 36 which is electrically and mechanically connected to the rack 32 and also connected to plating electrodes during the course of a plating process, and a clamper 38 which selectively fixed the rack 32 to the bar 36. The rack 32 has a first hole h1 which is used as an index at the time of transferring the rack 32 and a second hole h2 which is used as an index for fixing the rack 32.</p> |
申请公布号 |
JPH09121013(A) |
申请公布日期 |
1997.05.06 |
申请号 |
JP19960212669 |
申请日期 |
1996.08.12 |
申请人 |
SAMSUNG ELECTRON CO LTD |
发明人 |
CHIN FUKON;KIN TAIKAKU;RI KAYUN;KAN CHIYUUKAN |
分类号 |
H01L23/50;C25D17/08;H01L21/48;H01L23/495;(IPC1-7):H01L23/50 |
主分类号 |
H01L23/50 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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