发明名称 RACK MOUNTING LEAD FRAME AND LEAD FRAME PLATING SYSTEM USINGTHIS
摘要 <p>PROBLEM TO BE SOLVED: To automatically load/unload a rack mounted with a lead frame. SOLUTION: A lead frame mounting system is provided with a rack 32 for mounting a lead frame to be electroplated, a conductor supporting bar 36 which is electrically and mechanically connected to the rack 32 and also connected to plating electrodes during the course of a plating process, and a clamper 38 which selectively fixed the rack 32 to the bar 36. The rack 32 has a first hole h1 which is used as an index at the time of transferring the rack 32 and a second hole h2 which is used as an index for fixing the rack 32.</p>
申请公布号 JPH09121013(A) 申请公布日期 1997.05.06
申请号 JP19960212669 申请日期 1996.08.12
申请人 SAMSUNG ELECTRON CO LTD 发明人 CHIN FUKON;KIN TAIKAKU;RI KAYUN;KAN CHIYUUKAN
分类号 H01L23/50;C25D17/08;H01L21/48;H01L23/495;(IPC1-7):H01L23/50 主分类号 H01L23/50
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