发明名称 Method for detecting etching endpoint and etching apparatus and etching system using the method thereof
摘要 A method for detecting an etching endpoint and a plasma etching apparatus and a plasma etching system using such a device are disclosed, in which time series data of a signal corresponding to the amount of light of the plasma light generated during the plasma etching process are arithmetically processed, so that the change of light amount is corrected and an etching endpoint is detected from the time series data after the correction.
申请公布号 US5626714(A) 申请公布日期 1997.05.06
申请号 US19950568371 申请日期 1995.12.06
申请人 SUMITOMO METAL INDUSTRIES LIMITED 发明人 MIYAZAKI, TOSHIYA;HAYAMI, TOSHIHIRO;NAKATSUKA, TADAO;TANAKA, HIROYUKI;NAKAMURA, TOSHIYUKI
分类号 H05H1/46;C23F4/00;H01J37/32;H01L21/00;H01L21/302;H01L21/3065;H01L21/66;(IPC1-7):C23F1/02;H01L21/306 主分类号 H05H1/46
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