发明名称 |
Binder for use in metal powder injection molding and debinding method by the use of the same |
摘要 |
By the use of a binder comprising (a) 40 to 70 wt % of a water-soluble amide material and/or water-soluble amine material and (b) 25 to 60 wt % of a polyamide resin component substantially composed of a polyamide resin material having 10 carbon atoms or more on average between amido groups, a molded article is produced by metal powder injection molding. From such a molded article, the water-soluble amide material and/or water-soluble amine material is eluted by a water-based solvent and then, the polyamide resin component is removed by heating.
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申请公布号 |
US5627258(A) |
申请公布日期 |
1997.05.06 |
申请号 |
US19950403199 |
申请日期 |
1995.03.13 |
申请人 |
KABUSHIKI KAISHA KOMATSU SEISAKUSHO |
发明人 |
TAKAYAMA, TAKEMORI;MIYAKE, MASATO;OHYAMA, YOSHITAKA;SAITO, KATSUYOSHI;ONO, HIROSHI |
分类号 |
B22F1/00;B22F3/22;C08K3/08;C08K5/16;(IPC1-7):C08G73/10;C08K5/20;C08K5/347 |
主分类号 |
B22F1/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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