发明名称 Binder for use in metal powder injection molding and debinding method by the use of the same
摘要 By the use of a binder comprising (a) 40 to 70 wt % of a water-soluble amide material and/or water-soluble amine material and (b) 25 to 60 wt % of a polyamide resin component substantially composed of a polyamide resin material having 10 carbon atoms or more on average between amido groups, a molded article is produced by metal powder injection molding. From such a molded article, the water-soluble amide material and/or water-soluble amine material is eluted by a water-based solvent and then, the polyamide resin component is removed by heating.
申请公布号 US5627258(A) 申请公布日期 1997.05.06
申请号 US19950403199 申请日期 1995.03.13
申请人 KABUSHIKI KAISHA KOMATSU SEISAKUSHO 发明人 TAKAYAMA, TAKEMORI;MIYAKE, MASATO;OHYAMA, YOSHITAKA;SAITO, KATSUYOSHI;ONO, HIROSHI
分类号 B22F1/00;B22F3/22;C08K3/08;C08K5/16;(IPC1-7):C08G73/10;C08K5/20;C08K5/347 主分类号 B22F1/00
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