SEMICONDUCTOR PACKAGE SUBSTRATE AND MANUFACTURE THEREOF

摘要

PROBLEM TO BE SOLVED: To improve the alignment of bonding fingers in all stages. SOLUTION: On a substrate 20 having a chip mount 4 in a central part are stacked a plurality of substrates 2 having inner circuit patterns 1 arranged to surround the chip mount 4 and having their inner edges cut to expose connecting parts 1a in such a manner that tiers of cut edges are formed with the chip mount at the bottom. When bonding fingers for connecting the inner circuit patterns 1 are formed on the tiers, slant circuit patterns are used to connect the bonding fingers with the inner circuit patterns 1 that deviate in position.