Chip module e.g. for chip card

摘要

The chip module (10) has a chip (11) and a substrate (12) in contact with it and an insulating layer (13) on the substrate. The terminal conductors (14,15) stretch, side by side with a gap, on the insulation layers. The chip is made with two spigots (16,17) that pass through a passivation layer (18) and project beyond this. These spigots are the contact metallisations engaging in the terminal conductors and locate these in position. In addition, to provide good electrical contact between the terminal conductors and the contact region (21) for the chip, the recesses (19) are filled with bonding material (22) which conducts well.