摘要 |
An electronic packaging module for inverted bonding of semiconductor devices, integrated circuits, and/or application specific integrated circuits is produced with protuberances on the conductive pattern of the substrate. The protuberances are of a soft, ductile metal capable of being metallurgically bonded to the input/output pads of semiconductor devices. The input/output pads of the semiconductor devices are simultaneously bonded to the protuberances of the packaging module.
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