| 摘要 |
PROBLEM TO BE SOLVED: To prevent contamination caused by grinding liquid in a previous stage so as to prevent a reduction in quality or yield by providing a cleaner for cleaning a material ground in a grinding unit being removed from a top ring. SOLUTION: In the case of two-stage grinding, three cleaners are operated. The flow of a semiconductor wafer is a cassette 1a → a turn-over device 5 →a first grinding unit 1a → a cleaner 7a → a second grinding unit 1b → a cleaner 7b → turn-over device 6 → a cleaner 8b → a cassette 2a. A pusher 12 receives the semiconductor wafer from a robot 4b, raises when a top ring comes to an upper part and transfers the semiconductor wafer. The semiconductor wafer after grinding is rinsed and cleaned by a rinse liquid supply device. |
