| 摘要 |
PROBLEM TO BE SOLVED: To improve heat dissipation by providing four sub-islands which extend from the four sides of the major island excluding the connecting part of the four hanging leads that extend in the four directions from the four corners of the major island and providing a plurality of leads at the periphery of the sub-island. SOLUTION: A lead frame 10A capable of mounting various types of semiconductor chip has hanging leads 2, which extend in four directions from the four corners of a square major island 1, and four trapezoid sub-islands 3, which extend from the four sides of the major island 1, excluding the connecting part of the hanging lead 2. A plurality of leads 4A are provided in the vicinity of the sub-island 3 at the periphery. Thus, the lead frame 10A and a semiconductor device with improved heat dissipation are provided.
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