| 摘要 |
PROBLEM TO BE SOLVED: To suppress the generation of noise by preventing a semiconductor element from being physically damaged and increasing its size. SOLUTION: A plurality of bonding pads 1 for exchanging signal with a stitch 3 are provided on a semiconductor element 5 and the bonding pads 1 consist of a pad 8 for signal, a pad 6 for power supply/GND, and an additional bonding pad 7 which is connected to the pad 6 for power supply/GND by Al wiring 4 and is provided to reduce the inductance of a wire 2. The additional bonding pad 7 is installed on the same line as the pad 7 for power supply/GND in the vertical direction to the row of the bonding pad 1 and at the edge side of the semiconductor element 5 for the pad 6 for power supply/GND. |
