RETICLE FOR PROCESSING SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a reticle capable of accurately inspecting a pattern mistake and capable of extremely improving the quality and yield of products and being used for a first step at the time of an exposure process for manufacturing a semiconductor device. SOLUTION: Alignment marks consist of mutually adjacent main-scale pattern 28 and vernier pattern 26 formed in a pair, and the main-scale pattern 28 is composed of a square plate-shaped square plate pattern 30 and rod-shaped patterns 29 separated and formed along each side of the square plate pattern 30. The vernier pattern 26 is constituted so that it is contained in the square plate pattern 30 of the main-scale pattern 28 and relative positional relationship with the main-scale pattern 28 is inspected when the vernier pattern 26 is overlapped to the main-scale pattern 28.