| 摘要 |
PROBLEM TO BE SOLVED: To align both sides of a wafer at a lower cost while preventing deterioration of yield. SOLUTION: A device pattern 43 is aligned with a back side 10B of a wafer 10 by matching cross-shaped mask alignment marks 34S and 34T which are formed outside of the area of the wafer 10 on a dummy mask 30 fixed on the surface of the wafer 10 with rectangular mask alignment marks 44S and 44T which are formed outside of the area of the wafer 10 on a back side mask 40 for aligning the device pattern 43 with the back side 10B of the wafer 10. |
