| 摘要 |
PROBLEM TO BE SOLVED: To easily handle a compact semiconductor device by fixing a ball guide and a conductive ball which is guided to the ball guide on the electrode arrangement surface of a semiconductor chip via an anisotropic conductive film. SOLUTION: In a semiconductor 1, a conductive ball 6 which is supported and guided by a ball guide 5 via an anisotropic conductive film 4 is fixed on the main surface of a semiconductor chip 2, namely an electrode arrangement surface where an electrode (pad) 3 is provided. The conductive ball 6 is a metal ball with a diameter of for example 100-200μm. The ball guide 5 is formed by an insulation glass epoxy resin substrate which is for example approximately 100μm thick. A through hole 7 is provided at the ball guide 5 while the through hole 7 faces the electrode 3 of the semiconductor chip 2. The through hole 7 is in taper hole where the side of the anisotropic conductive film 4 is wide. Therefore, the conductive ball 6 enters the through hole 7 even if there is no anisotropic conductive film and is supported and guided by the ball guide 5.
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