| 摘要 |
A low temperature melting alloy based on the Sn-Pb-Bi system and articles bonded therewith are disclosed. The composition, which comprises between 48-52% by weight of Sn, 41-44% Pb, and 7-9% Bi, has a narrow melting range of about 169-175 DEG C. Addition of about 0.2 to 0.8% Ag is effective to reduce the melting range to about 166-172 DEG C. <IMAGE> |
