| 摘要 |
PROBLEM TO BE SOLVED: To provide a lead frame which has a pad having an excellent flatness with neither warp nor inclination and which has a semiconductor chip adhered with no bad adhesion and which has a good adhesion with sealing resin and also provide a very reliable semiconductor device. SOLUTION: A lead frame has a pad 1 where a semiconductor chip is to be mounted, a plurality of inner leads 5 formed around the pad 1, and a plurality of outer leads integrally formed with the inner leads. In such a lead frame, dimples 2 are formed in a rear face of the pad and a zigzag groove is formed in the periphery of a front face of the pad where the semiconductor chip is to be mounted. An adhesive is applied to an inner area of the zigzag groove formed in the front face of the pad 1 of the lead frame and then the semiconductor chip is adhered to that area and then the semiconductor chip and the inner leads are connected with metallic wires and then all the components are resin- sealed. |
