发明名称 Article comprising solder with improved mechical properties, and method of making the solder
摘要 <p>New solder compositions which can have improved mechanical properties are disclosed. In a preferred embodiment, the solder comprises a matrix material and magnetically dispersed particles. A desirable dispersion of the magnetic particles in the matrix material, is accomplished by applying a magnetic field to the molten matrix material containing magnetic particles and solidifying it in the presence of the magnetic field. The particle-dispersed microstructures improve the mechanical properties of the solder composition. The improved solder composition can be made into a powder to be used in solder paste, cream or reshaped while substantially retaining the improved mechanical properties.</p>
申请公布号 EP0612577(B1) 申请公布日期 1997.05.02
申请号 EP19940300936 申请日期 1994.02.09
申请人 AT&T CORP. 发明人 JIN, SUNGHO;MCCORMACK, MARK THOMAS
分类号 B22F1/02;B23K1/00;B23K35/02;B23K35/14;B23K35/24;B23K35/26;B23K35/40;C22C1/10;H01R43/02;H05K3/34;(IPC1-7):B23K35/14 主分类号 B22F1/02
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