发明名称 |
ELECTRONIC DEVICE |
摘要 |
<p>PROBLEM TO BE SOLVED: To cool a heat generating element to a prescribed temperature without preventing arranging constitution by providing a through-hole for a first wiring substrate and thermally connecting the heat generating element to be a cooling object and a heat radiating panel through this through-hole. SOLUTION: The heat radiating panel 11 of nearly the same size as the bottom surface of a housing is laid inside of the housing 7 and CPU 2 being the heat generating element is loaded on a second wiring substrate 3. Then an extended metallic plate 13 is fixed to the CPU 2 with a frame 14 through a flexible heat conductive member 12. Then the second wiring substrate 3 is electrically connected with a first wring substrate 1 through a connector 15. The second wired substrate 3 is fixed by sticking to the heat generating panel 11 or thermally connecting by inserting the flexible heat conductive member 12 between a heat generating block 16 obtained by providing a through-hole to the first wiring substrate 1 and the extended heat generating panel 13. Thereby CPU 2 being the heat generating element is cooled to be the prescribed temperature without preventing arranging constitution.</p> |
申请公布号 |
JPH09114552(A) |
申请公布日期 |
1997.05.02 |
申请号 |
JP19950265148 |
申请日期 |
1995.10.13 |
申请人 |
HITACHI LTD |
发明人 |
OHASHI SHIGEO;NAKAJIMA TADAKATSU;KONDO YOSHIHIRO;NAKAGAWA TAKESHI;IWAI SUSUMU;MATSUSHIMA HITOSHI |
分类号 |
G06F1/20;H05K1/02;H05K1/14;H05K7/20;(IPC1-7):G06F1/20 |
主分类号 |
G06F1/20 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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