| 摘要 |
PROBLEM TO BE SOLVED: To provide a mounting method of a characteristic evaluation board and a chip wherein mounting efficiency is high and mounting work I reduced. SOLUTION: This board is constructed in such a manner that the characteristic evaluation of a semiconductor chip 21 is made by connecting a bump 22 formed in the semiconductor chip 21 to an electrode 27 provided on a board body 24 corresponding to the bump so as to be conductive. In this case, the body 24 is provided with a housing part 25 for housing the semiconductor chip 21 and a clamp mechanism 28 for directly fixing the housed semiconductor chip 21 to the body 24 and thereby during fixing, the bump 22 is brought into contact by pressure with the electrode 27 of the body 24 and made conductive. Thus, when characteristic evaluation is made, the semiconductor chip 21 is easily mounted on the characteristic evaluation board without soldering and the bump 22 of the semiconductor chip 21 is formed by eutectic soldering, which improves mounting of the bump 22 to a device or the like. |
