发明名称 |
FIXING STRUCTURE OF SENSOR CHIP PROTECTIVE CAP |
摘要 |
<p>PROBLEM TO BE SOLVED: To provide a cap fixing structure which can surely eliminate backlash due to vibrations in spite of dispensing with troublesome bonding operations. SOLUTION: This sensor is provided with a sensor mount 5 for surrounding a sensor chip 4 mounted on a board 3, a sensor chip protective cap 6 for covering the whole thereof and a sealing agent 7 for sealing the board 3 and the cap 6. A small clearance part C2 for a sealing agent entering part for admitting the climbing of the fluid sealing agent 7 is provided between the inner circumferential surface of the cap 6 and the outer circumferential surface of the sensor mount 5. The cap 6 is fixed to the sensor mount 5 by the sealing agent 7 which creeps into the small clearance part C2. Accordingly, a bonding agent is not required.</p> |
申请公布号 |
JPH09113393(A) |
申请公布日期 |
1997.05.02 |
申请号 |
JP19950270282 |
申请日期 |
1995.10.18 |
申请人 |
TOKAI RIKA CO LTD |
发明人 |
OGISO KATSUYA;YAMASHITA KOSHIRO;IWATA HITOSHI |
分类号 |
G01P15/08;G01L9/04;G01P15/12;H01L23/28;(IPC1-7):G01L9/04 |
主分类号 |
G01P15/08 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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