| 摘要 |
PROBLEM TO BE SOLVED: To provide such a conductive film as being capable of being formed by low temperature heat treatment and sufficiently applied to a large base material by applying coating liquid containing specific metal particle sol on the base material to be heated. SOLUTION: Coating liquid containing sol (water sol, organosol, etc.) of metal particles selected from among Ag, Ru, Re, Ir, Os, Pt, Rh, Pd, Ni, Co, Sn, Cr, Au and In is applied to a base material to be heated. The average grain size of metal particles is not more than 1000 angstroms, preferably 50-800 angstroms, and the volume resistivity of powder is preferably not more than 0.01Ωcm. It is desirable that the application liquid contains silicate (hydrolyzed silicate or its partial hydrolysis) and additionally contains at least one type of metal oxide selected out of Sn, Sb, In, Zn, Ga, Al and Ru.
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