| 摘要 |
PROBLEM TO BE SOLVED: To easily form the connecting bump of an integrated circuit by forming the bump without treating the surface of a chip before the formation of the bump. SOLUTION: In the course of forming a connecting bump 13 on an integrated circuit or chip 11, an Sn/Zn alloy for welding is selectively deposited on the surface of a pad 12 formed on the chip 11 without treating the surface of the chip 11. The alloy composed basically of Sn and Zn has such a property that the alloy can be welded directly to the surface of an aluminum pad formed on the surface of the chip 11. |
