| 摘要 |
PROBLEM TO BE SOLVED: To provide a polishing work technology whereby a rugged part of a semiconductor wafer can be made flat, using a polishing pad contacted with the entire uneven part of the wafer due to its intrinsic warp, etc., and the load on the wafer can uniformly be controlled. SOLUTION: Polishing pads 2 made of a hard material, smaller than the area of a semiconductor wafer, are used. A polishing tool 1 is composed of the pads 2 fixed to their respective support members 4 formed to fit to thereto through layers. Loading means 6 and 7 are provided respectively for the pads 2 to control so that the load on the wafer from the tool 1 may be uniform during polishing of the wafer, using the tool 1. |
