| 摘要 |
PROBLEM TO BE SOLVED: To prevent the generation of uneveness, crack and break, by constituting a substrate of spinel, and making a resonator of sections wherein a nitride semiconductor wafer laminated on the substrate is cut off. SOLUTION: An N-type contact layer 2, an N-type clad layer 3, an N-type optical guide layer 4, an active layer 5, a P-type optical guide layer 6 and a P-type clad layer 7 are grown in order on a single crystal spinel substrate 1. On the layer 7, a protective layer is formed, on which an N-type current blocking layer 8 and a P-type contact layer 9 are grown. A positive electrode containing Ni and Au is formed almost at the center of the P-type contact layer 9. A stripe type negative electrode containing Ti and AQ is formed on the surface of the N-type contact layer 2. In the direction rectangular to the stripe electrode, scribing is performed, and the face wherein the wafer is divided in the direction is made a resonator. Since the crystal of spinel is softer than sapphire, working is easy. Generation of unevenness, crack and break of the nitride semiconductor layer of the resonance surface of the cut-off chip can be prevented. |
