发明名称 |
Photosensitive resin composition and photosensitive resin laminated film containing the same |
摘要 |
<p>A photosensitive resin composition comprising the following components (A), (B) and (C): (A) a photopolymerizable urethane (meth)acrylate compound containing at least two acryloyl or methacryloyl groups, (B) an alkali-soluble polymer compound having an acid value of from 50 to 250 mgKOH/g, and (C) a photopolymerization initiator, wherein the photosensitive resin composition has an electrical insulation resistance of 8.0x10<9> to 1.0x10<14> OMEGA .cm after photocuring. A photosensitive resin laminated film comprising a flexible film, a photosensitive layer provided on the flexible film, and a releasable film layer provided on the photosensitive layer, wherein the photosensitive layer comprises the above photosensitive resin composition.</p> |
申请公布号 |
EP0770923(A1) |
申请公布日期 |
1997.05.02 |
申请号 |
EP19960117273 |
申请日期 |
1996.10.28 |
申请人 |
TOKYO OHKA KOGYO CO., LTD. |
发明人 |
OBIYA, HIROYUKI,;MIZUSAWA, RYUMA |
分类号 |
B24C1/04;C08F2/46;G03F7/027;G03F7/09;(IPC1-7):G03F7/027 |
主分类号 |
B24C1/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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