发明名称 Hybrid integrated circuit device.
摘要 Hybrid switching arrangement has a resistance layer applied on one side of plate-like substrate made of glass or ceramic. A ceramic strip (6) is applied on one side of the substrate (1). Pref. the ceramic strip (6) is made of aluminium oxide, beryllium oxide or aluminium nitride, and is secured using heat conducting adhesive. The substrate (1) and strip (6) are both made of aluminium oxide and are both 1mm thick. The ceramic strip is at most 0.5 (pref. 0.1)mm thick.
申请公布号 EP0665560(A3) 申请公布日期 1997.05.02
申请号 EP19940119166 申请日期 1994.12.05
申请人 SIEMENS AKTIENGESELLSCHAFT 发明人 DREKMEIER, KARL-GERD, DIPL.-ING. (FH)
分类号 H01C1/01;H01C1/084;(IPC1-7):H01C1/084 主分类号 H01C1/01
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