| 摘要 |
The invention relates to forms (3, 4, 5) each with removal aids for the integrated cards (7). The removal aids involve, for example, punched sections adjoining the cards (7), similar to structure of the cards and removed from the form plane, and additionally the adhesion between the card (7) and a supporting layer (8) adjacent the removal aid is reduced. An explanation is also given of removal aids with holes which allow the integrated cards (7) to be engaged from behind from the front of the form. During the method, pressure is exerted on the punched sections, preferably using spikes, and said punched sections are bent out of the form plane. Pressure is exerted on the punched sections, similar to the structure of the cards (7), by the supporting layer (8) from behind, and on the forms with holes directly from the front. Complete removal subsequently takes place, e.g. by suction, peeling or by using a gripper. The invention also relates to devices for carrying out the method. |
