发明名称 LIQUID COOLED HEAT SINK FOR COOLING ELECTRONIC COMPONENTS
摘要 <p>A liquid cooled heat sink (100) for cooling heat generating components (112). The heat sink (100) has a base member (102) with open ended channels (104, 106) formed in at least one surface (118) thereof. The open ends (107) of the channels (104, 106) have a span (SU) less than a span (SL) across a lower portion of the channels (104, 106). A fluid conduit (114, 116) has an outer span (SL) greater than the span (SU) across the open ends (107) of the channels (104, 106) and a flattened surface (110) which is substantially coplanar with the surface (118) of the heat sink base member (102) having the channels (104, 106) therein.</p>
申请公布号 WO1997015801(A1) 申请公布日期 1997.05.01
申请号 US1996016990 申请日期 1996.10.23
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