发明名称 SURFACE ACOUSTIC WAVE DEVICE
摘要 PROBLEM TO BE SOLVED: To prevent such a trouble where the electrical connection secured between the input and output terminals via a metallic cap is cut off and the damping characteristic of a surface acoustic wave element is deteriorated due to its package by connecting the metallic cap to only one of both ground terminals which serve as the input and output terminals respectively. SOLUTION: A surface acoustic wave device 1 consists of a package 2, a surface acoustic wave element 3, a metallic cap 4, etc. The package 2 includes the 1st to 3rd ceramic substrates 5 to 7 which are laminated together and also has the input and output terminals. The cap 4 is bonded to an upper surface wiring film 37 to cover an opening part 36 which is formed on the 3rd ceramic substrate 7 and electrically connected to only an output ground terminal 14. More specifically, the cap 4 is electrically connected to the terminal 14 via the film 37, a cap connection wiring 39c, a cap connection pattern 40 and an output ground pad.
申请公布号 JPH09116377(A) 申请公布日期 1997.05.02
申请号 JP19950273141 申请日期 1995.10.20
申请人 FUJITSU LTD 发明人 UEDA MASANORI;FUJIWARA YOSHIAKI;GUNCHI SEI
分类号 H03H9/25;H03H9/05;H03H9/64 主分类号 H03H9/25
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