发明名称 |
RESIN FILLER AND MULTILAYER PRINTED WIRING BOARD |
摘要 |
A resin filler preferably packed in recesses occurring in the surface of a wiring board or in through holes provided therein, and a structure of a highly reliable built-up multilayer printed wiring board filled with the same resin filler are proposed. This resin filler is a solventless resin filler to be packed in the recesses occurring in the surface of a wiring board or in the through holes provided therein, the resin filler being characterized in that the filler contains resin components of bisphenol type epoxy resin and a curing agent of imidazole, and an additive component of inorganic particles as necessary. A built-up multilayer printed wiring board using this resin filler is also proposed.
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申请公布号 |
WO9716056(A1) |
申请公布日期 |
1997.05.01 |
申请号 |
WO1996JP03088 |
申请日期 |
1996.10.23 |
申请人 |
IBIDEN CO., LTD. |
发明人 |
KAWAMURA, YOICHIRO;MURASE, HIDEKI;ASAI, MOTOO |
分类号 |
H05K3/00;H05K3/38;H05K3/46;(IPC1-7):H05K3/46 |
主分类号 |
H05K3/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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