LIQUID CRYSTAL DISPLAY DEVICE HAVING TAPE CARRIER PACKAGE SEMICONDUCTOR DEVICE

摘要

A liquid crystal display device using a tape carrier packaged semiconductor device, which is designed to prevent a crack from developing in part of its resin mold. The semiconductor device is provided with a film-like substrate, a group of electrodes including a plurality of parallel electrodes, each of which is formed with its leading end conforming to one side of the film-like substrate and being elongated in the direction perpendicular to the one side thereof, a semiconductor chip mounted on the film-like substrate in such a manner that it abuts on the group of electrodes, located close to the one side thereof and connected via a wiring layer to the respective electrodes, and a resin mold for use in covering the semiconductor chip. Notches extending in the direction of the parallel electrodes are cut in the film-like substrate beneath the group of electrodes and wherein the leading and trailing ends of each electrode serves to link the electrode and the film-like substrate. A film-like substrate piece formed by the notch and used to support the leading end of each electrode is separated from the film-like substrate in the neighborhood of the resin mold.