| 摘要 |
Through-plated connections in multilayer conductor foils are prepared by the production of prepared through-plated connections on the conductor foils (1) which are to be processed later. To this end, these conductor foils (1) have a photoresist (2) laminated onto them in such a manner that a freely selectable pattern of recesses (3, 3') in the photoresist is exposed and developed in a photochemical process, that metal (4, 4') is plated into these recesses (3, 3') in an electrochemical plating process, that the photoresist (2) is subsequently removed, that at least two conductor foils (1, 10) are compressed in such a manner that the conductor foils (1, 10) are separated by at least one intermediary adhesive film (5) as a bonding agent, and that each adhesive film (5) is laminated onto at least one conductor foil (10), each of these intermediary adhesive films (5) rests against at least one conductor foil (1) which is processed with prepared through-plated connections (4, 4'), in such a manner that, during the compression of at least two conductor foils (1, 10), the through-plated connections (4, 4') which have been prepared on at least one of the conductor foils (1, 10) in each case pass through the intermediary adhesive film (5), and through-plated connections (15, 15') are formed between these conductor foils (1, 10). <IMAGE> |
