| 摘要 |
PURPOSE:To contrive the improvement of productivity and labor saving by a method wherein the title device is provided with a molding metal mold unit for sealing and molding the electronic components of a lead frame, a device for putting the lead frame in the molding metal mold unit and a molded product taking-out unit for taking out molded products after the electronic components of the lead frame are molded by sealing. CONSTITUTION:A lead frame is put in a molding metal mold unit A by a frame putting-in unit C, electronic components of the lead frame are molded by sealing by the unit A and the electronic components molded by sealing are taken out of the unit A by a molded product taking-out unit E. Accordingly, the lead frame can be automatically put in and at the same time, molded products can be automatically taken out after the parts are molded by sealing. Thereby, with the improvement of productivity and labor saving contrived, it becomes possible that a molding material is molded in a tablet form to feed simply to the unit A. |
