| 摘要 |
An interconnect structure is characterized by a matrix formed of a continuous, substantially oxygen impermeable, anhygroscopic, inorganic dielectric material, having a dispersion of metal particles therein. The metal particles have an insulating layer thereon and are in abutting contact. The application of a predetermined electrical potential between spaced first and second points on the surface of the interconnect structure causes electrical breakdown of the coatings on the particles in the region between the points of application thereby irreversibly forming an electrical conduction path through the interconnect structure between the first and the second points.
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