发明名称 Vortex tube cooling system for solder reflow convection furnaces
摘要 A vortex tube cooling system is presented. The cooling system contains one or more vortex tubes connected to a supply of compressed gas, the vortex tubes providing a stream of cold gas which cools product as it emerges from a furnace. The cooling system is particularly useful for cooling circuit boards emerging from a solder reflow convection furnace.
申请公布号 US5623829(A) 申请公布日期 1997.04.29
申请号 US19960587466 申请日期 1996.01.17
申请人 BTU INTERNATIONAL 发明人 NUTTER, FRANCIS C.;HUTCHINGS, MARK
分类号 B23K1/008;F25B9/04;(IPC1-7):F25B9/02 主分类号 B23K1/008
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