发明名称 |
Vortex tube cooling system for solder reflow convection furnaces |
摘要 |
A vortex tube cooling system is presented. The cooling system contains one or more vortex tubes connected to a supply of compressed gas, the vortex tubes providing a stream of cold gas which cools product as it emerges from a furnace. The cooling system is particularly useful for cooling circuit boards emerging from a solder reflow convection furnace.
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申请公布号 |
US5623829(A) |
申请公布日期 |
1997.04.29 |
申请号 |
US19960587466 |
申请日期 |
1996.01.17 |
申请人 |
BTU INTERNATIONAL |
发明人 |
NUTTER, FRANCIS C.;HUTCHINGS, MARK |
分类号 |
B23K1/008;F25B9/04;(IPC1-7):F25B9/02 |
主分类号 |
B23K1/008 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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