Structure of a thermally and electrically enhanced plastic pin grid array (PPGA) package for high performance devices with wire bond interconnect

摘要

An integrated circuit package that contains a multi-layer printed circuit board that is coupled to a plurality of external mounting pins and an integrated circuit. The multi-layered circuit board has a plurality of inner bonding pads that are coupled to the integrated circuit and routed directly to the pins without use of any vias. The printed circuit board has multiple voltage/ground layers so that different power levels can be supplied to the integrated circuit board. The integrated circuit is mounted and electrically grounded to a heat slug that is also coupled to the printed circuit board. The heat slug provides the dual function of a ground plane and a thermal sink for the package. The pins and package are typically configured in a conventional PPGA package arrangement.