| 摘要 |
The apparatus relates to an automatic process for the soldering of the QFD to the PCB. This automatic soldering process is started and stopped by an operator. While in operation all commands are carried out by a computer. The apparatus includes: a robot determining the exact position to solder the QFP IC to the PCB, a vacuum pad device conveying the QFP IC, a soldering device, a robot providing solder to the soldering device, a CCD camera capturing the soldering position for the QFP IC and sending the processed image to a vision controller, a vision controller adjusting the position of QFP IC, a computer controlling the other devices, and QFP IC box containing QFP ICs.
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