Spaltbare Diepoxyde als entfernbarer Vorrichtungsschutz für elektronisches Gehäuse
摘要
<p>Chips mounted into substrates are often encapsulated with a cured epoxy which is insoluble. The invention herein is the discovery that diepoxides with ketal linkages are soluble. This permits encapsulating chips, testing them for goodness and removing the chips for rework by dissolving the epoxy without destroying the chip or substrate. <IMAGE></p>
申请公布号
DE69218327(D1)
申请公布日期
1997.04.24
申请号
DE1992618327
申请日期
1992.08.10
申请人
INTERNATIONAL BUSINESS MACHINES CORP., ARMONK, N.Y., US
发明人
BUCHWALTER, STEPHEN L., WAPPINGERS FALLS, NY 12590, US;KOSBAR, LAURA L., MOHEGAN LAKE, NY 10547, US;NEWMAN, BERT H., CARMEL, NY 10512, US;POMPEO, FRANK L., WALDEN NY 12586, US
