发明名称 SOLDER ELEMENT
摘要 <p>The invention relates to a solder element for making electrically conducting connections on either side of a printed circuit board, comprising an electrically conducting wire which is provided with at least one body composed of solder material and flux material, wherein the body is preferably composed of solder material and provided with a recess in which the flux material is received, or the flux material is preferably accommodated between two bodies of solder material arranged on the wire.</p>
申请公布号 WO1997015097(A1) 申请公布日期 1997.04.24
申请号 NL1996000410 申请日期 1996.10.21
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