发明名称 |
METHOD AND DEVICE FOR DETECTING END POINT OF PLASMA TREATMENT, METHOD AND DEVICE FOR MANUFACTURING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE |
摘要 |
The wavelength components (27) of an active species are extracted from the light (24) emitted from a plasma, and only the frequency components synchronous with the high-frequency power for plasma excitation are extracted by means of a synchronous detection circuit (30) or the like, in order to allow the device to always stably detect the end point of plasma treatment with high accuracy without receiving any influence from the very fine pattern to be treated and disturbance. The progress of plasma treatment is recognized more accurately and the signal change at the end point is clear and the end point of plasma treatment of a very small opening pattern is detected with high accuracy.
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申请公布号 |
WO9715074(A1) |
申请公布日期 |
1997.04.24 |
申请号 |
WO1996JP03042 |
申请日期 |
1996.10.21 |
申请人 |
HITACHI, LTD.;NAKATA, TOSHIHIKO;NINOMIYA, TAKANORI |
发明人 |
NAKATA, TOSHIHIKO;NINOMIYA, TAKANORI |
分类号 |
C23F4/00;H01J37/32;H01L21/302;H01L21/3065;H01L21/66;(IPC1-7):H01L21/306 |
主分类号 |
C23F4/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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