摘要 |
<p>A blister package (10) is formed of a rupturable substrate (12), a blister layer (11) formed over the rupturable substrate and a medicament (15) contained between the blister layer and the rupturabe substrate. The blister package can be opened an give access to the medicament by deforming the blister layer so that it punctures the rupturable substrate and allows the medicament to be removed thereform, without applying directly a mechanical pressure on the medicament. This allows friable tablets to be protected and minimizes the breakage of all types of tablets during the opening of the blister pack.</p> |