| 摘要 |
PURPOSE: To obtain a protective effect for an IC chip to the maximum by reducing the thickness of the edge of the reinforcing part to be buried in the substrate of a card. CONSTITUTION: A set of reinforcing plates 11a, 11b and 12a, 12b are placed between the cover film 3 or 4 and IC surfaces 7a, 7b as sandwiching the IC chip. The reinforcing plates are made of the same material of metal film having high elasticity and thinner edges. The dimensions of the reinforcing plate are larger than those of IC chips 7a, 7b so that the difference D of them should be within the range of 0.5 to 5 mm. This structure realize that the cover film is not damaged when the card is forced to bent and the operation reliability, the stability for environment, and the beauty of the card are improved. |
