SEMICONDUCTOR ELEMENT MOUNTING PLASTIC PACKAGE AND MANUFACTURE THEREOF

摘要

PROBLEM TO BE SOLVED: To provide a semiconductor element mounting plastic package having a heat radiation board in which reliability of junction between the plastic package and the radiation board or between a semiconductor element and the radiation board may be achieved even at the time of mounting a large-scale semiconductor element and which does not require any complex manufacturing processes. SOLUTION: This package includes a radiation board 3, and a plastic package body 1 which surrounds a semiconductor element 9 joined with the radiation board 3 via a junction layer 8 and which is joined with the radiation board 3 via a junction layer 7. The radiation board 3 contains at least one alloy selected from the group of copper-tungsten alloy containing 25-40% by weight of copper, copper-molybdenum alloy containing 25-40% by weight of copper, and copper-molybdenum-tungsten alloy containing 25-40% by weight of copper. The surface of the radiation board 3 which is joined with the semiconductor element 9 and the plastic package body 1 has a centerline average plane roughness (Ra) within a range of 0.2-1.5μm.