| 摘要 |
<p>A multi-layer bottom lead package of the present invention has semiconductor chips having: (a) bonding pads; (b) an insulating circuit film including (i) an insulating base film with through holes, (ii) first metal lines formed on upper and lower faces of the base film, (iii) protruding, conductive inner pads which are respectively formed on the first metal lines, being respectively connected to said bonding pads of each semiconductor chip, (iv) protruding, conductive outer pads which are formed on the first metal line, and (v) second metal lines formed along wall surface of the through holes to connect to the inner pads of each semiconductor chip; (c) a lead frame including an inner lead and outer lead for electrically connecting the outer pads of the insulating circuit film to an external device; and (d) a package body of encapsulating a predetermined area containing the semiconductor chips, the insulating circuit film and the inner leads of the lead frame, including a plurality of dimples formed at electrical connection positions for signal transfer with the external device, wherein the the outer leads extends to the dimple, each end of the outer leads being exposed at an equal level as the bottom surface of the package body.</p> |
