| 摘要 |
PROBLEM TO BE SOLVED: To enhance a semiconductor device in chip mounting density by a method wherein memory chip sets each composed of laminated memory chips are mounted an a mounting board, the surface of a memory chip where bump electrodes are formed is so set as to face in a direction opposite to a mounting board, one end of a lead is connected to the bump electrode, and the other end of the lead is electrically connected to a wire formed on the mounting board. SOLUTION: Bump electrodes 6 of solder or the like are provided on each of semiconductor chips 4A to 4D. Leads 5A to 5D arc connected to the bump electrodes 6 through a TAB method respectively. The semiconductor chips 4A and 4B are mounted on the front of a semiconductor board 1 as the semiconductor chip 4A is put on the semiconductor chip 4B, and the leads 5A and 5B are connected together when the chips 4A and 4B are possessed of the same function. The semiconductor chips 4C and 4D are mounted on the rear of the semiconductor board 1 as the semiconductor chip 4D is laminated on the semiconductor chip 4C and connected together when they are possessed of the same function. The chips 4A to 4D are connected to the leads 5A to 5D through a TAB method respcectively and mounted on the semiconductor board 1, whereby the chips 4A to 4D can be lessened in mounting area, and many chips can be mounted on the module board 1, so that a semiconductor device of this constitution can be enhanced in chip mounting density. |
