SUBSTRATE TREATING DEVICE

摘要

PROBLEM TO BE SOLVED: To provide the subject device having a small occupancy area and high operating efficiency. SOLUTION: In this device, plural reaction chambers 70 are placed on a wall 53 of a wafer conveyance room 50 so that the chambers 70 are apart from each other and stacked up in the vertical direction. Also, plural wafer receiving chambers 30 are placed on another wall 54 of the wafer conveyance room 50 so that the chambers 30 are apart from each other and stacked up in the vertical direction. Further, a gate valve 93 is placed in the space between the wafer conveyance room 50 and each of the reaction chambers 70 and a gate valve 92 is placed in the space between the wafer conveyance room 50 and each of the wafer receiving chambers 30. The wafer conveyance room 50 is constructed so that the room 50 can be evacuated to a vacuum and the inside of the room 50 is provided with a wafer conveying vacuum robot 60 capable of conveying substrates under vacuum within the space between the set of the reaction chambers 70 and the set of wafer receiving chambers 30.