发明名称 MOUNTING OF HEAT SINK FIN
摘要 PROBLEM TO BE SOLVED: To improve degree of freedom in the direction of clamping in mounting a heat sink fin onto a heat sink fin mounting plate, by forming matrix-like small cubical protrusions on the surface of the heat sink fin mounting plate and clamping the protrusions into mounting holes of the heat sink fin. SOLUTION: A rectangular wave-shaped heat sink fin 12 is formed such that a half of a rectangular mounting hole 11 thereof is located on the bottom while the remaining half vertically extends. A heat sink fin mounting plate 18 is formed which has a small cubical protrusion 17 at a position corresponding to the mounting hole 11 of the heat sink fin 12. The mounting hole 11 is fitted with the small cubical protrusion 17, and the heat sink fin 12 is set on the heat sink fin mounting plate 18. By clamping each small cubical protrusion 17 in each mounting hole 11, the heat sink fin 12 is fixed in contact with the surface of the heat sink fin mounting plate 18. Thus, the direction of clamping may be any direction of the small cubical protrusion 17.
申请公布号 JPH09107056(A) 申请公布日期 1997.04.22
申请号 JP19950265230 申请日期 1995.10.13
申请人 SONY CORP 发明人 FURUKAWA HIROSHI
分类号 H01L23/36;(IPC1-7):H01L23/36 主分类号 H01L23/36
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