| 摘要 |
PROBLEM TO BE SOLVED: To produce a ceramic sputtering target less liable to generate nodules at the time of sputtering and hardly causing abnormal electric discharge and the occurrence of particles. SOLUTION: This sputtering target is a ceramic (ITO, et.) sputtering target produced by powder metallurgical processing, the center line average roughness Ra of the surface to be sputtered is 0.1-3.0μm and the average peak-to-peak interval (Sm value) of the surface roughness curve is >=150μm. In the case of an ITO target, the density D (g/cm<3> ) and bulk resistance ρ (mΩcm) satisfy 6.20<=D<=7.23 and -0.0676D+0.887>=ρ>=-0.0761D+0.666, respectively. The surface properties are attained by carrying out blasting with glass, alumina or zirconia beads of <=500μm diameter as a blasting material. |
