发明名称 MANUFACTURE OF COPER PLANTED WIRE
摘要 PROBLEM TO BE SOLVED: To manufacture a copper plated wire with its good workability, low cost, and good quality in an extremely thin coaxial wire to be used as a high-frequency transmission line. SOLUTION: In a pre-electrolytic processor 100, plural plated wire rods s arranged in parallel is continuously run at a speed of 0.1m per second to 0.5m per second, and these plated wire rods s are put into a copper sulfate plating bath Y in an overflow reservoir 31 and linearly passed. In addition, the wire rod is brought into contact with the peripheral face (power supply conductor face) of a power supply roller 22 by which a constant voltage Vc is supplied, a copper plated thin film intermediate layer is formed by means of flush plating, and a plating wire s' is obtained. A copper plating layer is formed by means of electric plating, and a copper plating wire is obtained. The composition of said copper-sulfate plating solution Q is 80 to 120g/l in copper sulfate and 80 to 120g/l in sulfuric acid (specific gravity 1.84).
申请公布号 JPH09106716(A) 申请公布日期 1997.04.22
申请号 JP19950265315 申请日期 1995.10.13
申请人 TOTOKU ELECTRIC CO LTD 发明人 KITAZAWA HIROSHI;YAMAGUCHI TATSUO;YOSHIMURA SHUNICHI
分类号 C25D7/06;H01B13/00;H01B13/016 主分类号 C25D7/06
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