| 摘要 |
PROBLEM TO BE SOLVED: To provide an electronic component mounting board wherein insertion resistance of a lead pin into a through hole small and which is excellent in solder junction property between a through hole and a lead pin and a manufacturing method thereof. SOLUTION: The head part 21 of a lead pin 2 is inserted to a through hole 1 provided on an insulation base 5. A gold plated film 11 is applied to an inner wall of the through hole 1 and a gold plated film 22 is also applied to the head part 21 of a lead pin. A through hole and a lead pin are joined by solder. When the head part of a lead pin is inserted, dilute solution which is formed by diluting flux by solvent is applied to the inner wall of a through hole and is set to touch and a flux film 7 is formed in an inner wall of the through hole 1. Thereafter, the head part of a lead pin is inserted into a through hole. It is desirable to apply a dilute liquid also to the head part of a lead pin and set to touch, and to form a flux film in advance. |
