发明名称 METHOD FOR PLATING WORK AND APPARATUS THEREFOR
摘要 PROBLEM TO BE SOLVED: To reduce an operation cost and to improve performance by executing pretreatments, such as degreasing and washing, and executing post treatments, such as neutralizing, by exposing works under transportation to an injection liquid, etc. SOLUTION: The works are subjected to the pretreatments, such as washing and etching, in a pretreating vessel 11 in order to apply plating on the works L. Next, the works are subjected to a plating treatment in a plating cell 12 and the post treatments, such as neutralizing and drying in a post treating vessel 13. Plural trays 1 nearly horizontally housing lead frames L which are the works are, thereupon, made to travel in the respective treating vessels 11, 12, 13 by using conveyor chains 4, etc. Flow parts are formed in the trays 1 to allow the flow of fluid. The works L are plate-treated by immersing the works into the plating liquid. The pretreatments, such as degreasing, washing and etching and the post treatments, such as neutralizing, are executed by exposing the works L under the transportation to the injection liquid, mists or atmosphere. As a result, the versatility to differences of the plating stage is enhanced.
申请公布号 JPH09104999(A) 申请公布日期 1997.04.22
申请号 JP19950282641 申请日期 1995.10.04
申请人 EBARA CORP 发明人 SUZUKI KENICHI;HONGO AKIHISA;OZAWA NAOMITSU
分类号 C25D7/00;C25D7/12;C25D17/00;C25D17/08;C25D21/08;H01L23/48;H01L23/50;(IPC1-7):C25D17/00 主分类号 C25D7/00
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